Design for reliability with the advanced integrated circuit (IC) technology: challenges and opportunities
نویسندگان
چکیده
منابع مشابه
Reliability challenges in 3D IC packaging technology
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: [email protected] At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order ...
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ژورنال
عنوان ژورنال: Science China Information Sciences
سال: 2019
ISSN: 1674-733X,1869-1919
DOI: 10.1007/s11432-019-2643-5